HIGH SPEED BOARD-TO-BOARD
EDGE CARD / MICRO BACKPLANE
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STANDARD BOARD-TO-BOARD
RUGGED / POWER
HIGH SPEED CABLE ASSEMBLIES
ACTIVE OPTICS
RF CABLE AND COMPONENTS
IDC / DISCRETE WIRE
PANEL & I/O
STANDARDS / PLATFORMS
CUSTOM PRODUCTS
PRODUCT INFORMATION
QUALITY / PROCESSING / TOOLS
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RUGGED / POWER INTEGRITY
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Standards / Platforms
BROADCAST VIDEO
Broadcast Video - 3G SDI


true 75Samtec's signal integrity expertise and high speed interconnect solutions are ideal for many of the physical and electrical routing challenges facing the broadcast video industry.

With the advent of 3 Gbps Serial Digital Interface (3G SDI) enabling uncompressed digital transfer of 1080p and digital cinema, signal integrity design expertise is more important than ever to ensure the required bandwidth is available in the finished product.

True75Ω RF Systems
True75™Ω connectors are certified 75Ω +/- 3Ω for straight and +/- 4Ω for right angle and are ideal for 3 Gbps. The Samtec RF systems listed below help ensure that your design will meet and/or surpass 3G SDI requirements.
modified        bnc
Product Orientations Samtec Part Number
75Ω BNC Jack Vertical BNC7T
Edge Mount
Right Angle
75Ω SMB Jack Vertical SMB7H
Edge Mount
Right Angle
75Ω MCX Jack Vertical MCX7
Edge Mount
Right Angle
Board-to-Board Solutions for 3G SDI

Samtec board-to-board interconnects meet or exceed requirements for 3G SDI rear panel I/O card interfaces. These connectors are available in coplanar, right angle, and vertical orientations for maximum design and routing flexibility.

Product Perpendicular Coplanar
High Speed Edge Card
with Edge Rate™ Contacts
HSEC8-DV to
Card Edge
HSEC8-EM to
 Card Edge
SEARAY™  
High Density Arrays
SEAM to
SEAF-RA
SEAM-RA to
SEAF-RA
SEAM-RA to
SEAF
Q2 High Speed Strips
with Ground/Power Planes
QMS-RA to
QFS
QMS-RA to
QFS-RA
QMS to
QFS-RA
QMS-EM to
QFS
QMS-EM to
QFS-EM
QMS to
QFS-EM
Rugged High Speed
Edge Rate™ Strips
ERM8-RA to
ERF8
ERM8-RA to
ERF8-RA
ERM8 to
ERF8-RA
ERM8-EMX to
ERF8
ERM8-EMX to
 
ERF8-EMX
ERM8 to
ERF8-EMX


mod
Full Turnkey Modules

Samtec also designs full passive I/O modules. Modules include I/O connectors, board/trace layout for optimum 75Ω performance, and passive to active board connector solutions. Our experience and signal integrity expertise ensures accuracy on the first design, saving you time, design resources, and design iterations.

Contact 3GSDI@samtec.com for more information.

kit
3G SDI Test Kits

Samtec, in conjunction with Brioconcept and Gennum has developed a customized Final Inch® evaluation kit for 75Ω 3G protocol. The kit is exceptionally accurate at measuring 3G SDI signal quality in the connector breakout regions. It simulates the entire transmission line paths from BNCs through high speed interconnect (the Samtec HSEC8 Series) and the equalizers and cable drivers on the active board.

The evaluation kit utilizes high quality Samtec SMA Connectors to launch signals to/from the system for performance measurement. The True 75™ BNC is also integrated into the passive interface cards with all three typical orientations represented:

Contact finalinch@samtec.com for more information.

 
Additional Information:
Broadcast Video Solutions Brochure

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