HIGH SPEED BOARD-TO-BOARD
EDGE CARD / MICRO BACKPLANE
MICRO PITCH BOARD-TO-BOARD
STANDARD BOARD-TO-BOARD
RUGGED / POWER
HIGH SPEED CABLE ASSEMBLIES
RF CABLE AND COMPONENTS
IDC / DISCRETE WIRE
PANEL & I/O
STANDARDS / PLATFORMS
CUSTOM PRODUCTS
PRODUCT INFORMATION
QUALITY / PROCESSING / TOOLS
SIGNAL INTEGRITY SERVICES
RUGGED / POWER INTEGRITY
SUDDEN SERVICE
SERVICE CENTER
TECHNICAL LIBRARY
 
Micro Pitch Board-to-Board
.050 INCH x .100 INCH SYSTEMS
Terminal Strips
Specifications
  • Pitch: .28" (7,11mm) - .900" (23mm)
  • Contacts:  Up to 100 I/Os
Series
  • TMS – Standard Through Hole Header
  • MTMS – Modified Header
  • HTMS – High Temp Header
  • TML – Shrouded Header
  • DWM – Board Stacker
  • HDWM – High Temp Stacker
  • ZML – Shrouded Stacker
  • FTR – Surface Mount Header
  • SNM – Shunt

 
Features
  • Wide array of board stacking heights
  • Various mating orientations
  • Rugged options
Additional Links
Socket Strips 
Specifications
  • Pitch: .050” (1,27mm)
  • Contact: .100” (2,54mm)
Series
  • SMS – Standard Socket
  • SLM – Low Profile Socket
  • RSM – Surface Mount Socket

 
Features
  • Wide array of board stacking heights
  • Pass through sockets available
Additional Links

If you do not find the product series you are looking for above, please contact eNewProducts.

To ensure a product meets TS 16949, automotive, or any other specific standards, the product must be an ACD Series. Go to www.samtec.com/TS for complete details.
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