HIGH SPEED BOARD-TO-BOARD
EDGE CARD / MICRO BACKPLANE
MICRO PITCH BOARD-TO-BOARD
STANDARD BOARD-TO-BOARD
RUGGED / POWER
HIGH SPEED CABLE ASSEMBLIES
RF CABLE AND COMPONENTS
IDC / DISCRETE WIRE
PANEL & I/O
STANDARDS / PLATFORMS
CUSTOM PRODUCTS
PRODUCT INFORMATION
QUALITY / PROCESSING / TOOLS
SIGNAL INTEGRITY SERVICES
RUGGED / POWER INTEGRITY
SUDDEN SERVICE
SERVICE CENTER
TECHNICAL LIBRARY
 
Micro Pitch Board-to-Board
COMPRESSION / ONE PIECE SYSTEMS
MICRO PITCH ONE PIECE
One Piece Interface 
Specifications
  • Pitch: 1mm (.0394”)
  • Stack Height: 1,65mm (.065”)
  • Contacts: Up to 30 I/Os
Series
  • SEI – One Piece Interface

 
Features
  • Fine pitch
  • Low profile
  • Optional screw inserts
  • Optional alignment pins
Additional Links
One Piece Elevated Profile System
Specifications
  • Pitch: 1mm (.0394”)
  • Stack Height:
    o  3mm (.118”)
    o  6mm (.236”)
    o  10mm (.393”)
  • Contacts: Up to 100 I/Os
  • Performance: Up to 12.0 GHz/24 Gbps
Series
  • FSI – One Piece Interface

 
Features
  • Fine pitch screw mount option available Flex Data Link mating option available
Additional Links
Low Profile One Piece Interface
Specifications
  • Pitch: 1mm (.0394")
  • Stack Height: .025" (.64mm), .050" (1,27mm)
  • Contacts: Up to 25 I/Os
  •  
Series
  • SEL – Low Profile One Piece Interface
 
Features
  • Fine pitch
  • Low Profile
 
Additional Links  
High Cycle One Piece Interface
Specifications
  • Pitch: 1mm (.0394")
  • Stack Height: .142" (3,60mm)
  • Contacts: Up to 320 I/Os
  •  
Series
  • SCA – H-Pin® High Cycle One Piece Interface
 
Features
  • H-Pin®
  • Dual Alignment pin
  • Low coast stamped pin construction with machined pogo pin performance
 
Additional Links

H-Pin® registered trademark of Plastonics

 
Specifications
  • Pitch: .050” (1,27mm)
  • Stack Height: 3,00MM (.118")
  • Contacts: up to 30 I/Os
Series
  • SIBF – One Piece Interface
Features
  • Low profile
  • Choice of alignment pins
Additional Links
HIGH DENSITY INTERFACE
High Density Board Interface
Specifications
  • Pitch: .050” (1,27mm)
  • Stack Height:
    o  .065” (1,65mm)
    o  .118" (3mm)
  • Contacts: Up to 900 I/Os
Series
  • GFZ – Solderless High Density Board Interface

 
Features
  • Features ideal for board stacking, module-to-board, and LGA interfaces
  • Solderless interface
Additional Links
.100” (2,54mm) PITCH
One Piece Power Interface
Specifications
  • Pitch: .100” (2,54mm)
  • Stack Height: 3mm (.118")
  • Contacts: Up to 10 I/Os 
  • Current Rating: 2.4A per pin
Series
  • OPP – One Piece Power Interface

 
Features
  • Screw insert option for rugged environments
  • Alignment pins on either side of connector

 

Additional Links
One Piece Interface
Specifications
  • Pitch: .100” (2,54mm)
  • Stack Height: 3,81mm (.150”)
  • Contacts: Up to 30 I/Os 
Series
  • SIB – One Piece Interface

 
Features
  • Screw insert option for rugged environments
  • Large contact deflection
Additional Links
Specifications
  • Pitch: .100” (2,54mm)
  • Stack Height: 6mm (.236”)
  • Contacts: Up to 15 I/Os
Series
  • SIR1 – Right Angle,  One Piece Interface
Features
  • Right angle orientation
  • Large contact deflection
Additional Links
Pogo Pin One Piece Interface
Specifications
  • Pitch: .100” (2,54mm)
  • Stack Height: 4,50mm (.177”)
  • Contacts: Up to 10 I/Os
Series
  • PGP – Pogo Pin One Piece Interface

 
Features
  • Double or single row
  • Optional alignment pins
Additional Links

If you do not find the product series you are looking for above, please contact eNewProducts.

To ensure a product meets TS 16949, automotive, or any other specific standards, the product must be an ACD Series. Go to www.samtec.com/TS for complete details.
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