HIGH SPEED BOARD-TO-BOARD
EDGE CARD / MICRO BACKPLANE
MICRO PITCH BOARD-TO-BOARD
STANDARD BOARD-TO-BOARD
RUGGED / POWER
HIGH SPEED CABLE ASSEMBLIES
RF CABLE AND COMPONENTS
IDC / DISCRETE WIRE
PANEL & I/O
STANDARDS / PLATFORMS
CUSTOM PRODUCTS
PRODUCT INFORMATION
QUALITY / PROCESSING / TOOLS
SIGNAL INTEGRITY SERVICES
RUGGED / POWER INTEGRITY
SUDDEN SERVICE
SERVICE CENTER
TECHNICAL LIBRARY
 
Micro Pitch Board-to-Board
FOUR ROW / HIGH DENSITY SYSTEMS
.050” (1,27mm) Quad Row Socket / Terminal
Specifications
  • Pitch: .050” (1,27mm)
  • Stack Height: .25" (6,35mm) - .472" (12mm)
  • Contacts: Up to 200 I/Os
  • Mating:  .050" (1,27mm)
  • Footprint: .025" (.635mm)
Series
  • SOLC – Quad Row Socket
  • TOLC – Quad Row Terminal 


Features
  • Staggered row layout
  • .025” (.635mm) footprint
  • Optional locking clips and alignment pins
Additional Links
.050” (1,27m) x .050” (1,27mm) Quad Row  Socket / Terminal
Specifications
  • Pitch: .050” (1,27mm)
  • Stack Height: .235" (5,97mm) - .45" (11,43mm)
  • Contacts: Up to 200 I/Os
Series
  • ROLC – Quad Row Socket
  • MOLC – Quad Row Terminal
  • FOLC – Quad Row Terminal, Through-Hole



 
Features
  • Surface mount, through-hole, and mixed technology available
  • Reliable Tiger Eye™ contacts
  • Optional locking clips
Additional Links

If you do not find the product series you are looking for above, please contact eNewProducts.

To ensure a product meets TS 16949, automotive, or any other specific standards, the product must be an ACD Series. Go to www.samtec.com/TS for complete details.
Contact Us  |   About Us  |   Jobs  |   Environmental Compliances  |   Help  |   Recent News  |   New Products
           
Copyright © Samtec, Inc