| DATE |
TITLE |
AUTHOR/
PUBLICATION |
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OUT
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| PRESENTATIONS
TOP |
| 02/08 |
DesignCon 2008 - RealTime interview with Brian Vicich on how Samtec makes the PCB designer’s job easier. |
Brian Vicich, Samtec |
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| 02/08 |
DesignCon 2008 - Pushing the Envelope without Tears: An Advanced Power Delivery Solution |
Steve Weir, Teraspeed Consulting |
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| 02/08 |
DesignCon 2008 - High Bandwidth Modeling and Simulation of SSO Effects on Single-Ended Switching Performance of Complex FPGA System Designs |
Scott McMorrow, Steve Weir, Teraspeed Consulting and Chris Herrick, Steve Pytel, Ansoft Corporation |
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| 02/08 |
DesignCon 2008 - Test Fixturing and Measurement Methodology |
Emad Soubh, Samtec,Inc.
Brock LaMeres, Probing Technology
Brent Holcombe, Probing Technology |
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| 02/08 |
DesignCon 2008 - Mode Conversion and EMI Performance |
Jim Nadolny
Samtec, Inc. |
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12/07 |
Shielded Cable Assemblies & EMI Performance |
Jim Nadolny
Samtec, Inc. |
|
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08/07 |
PowerPoser™ Interposers |
Samtec, Inc and
Teraspeed Consulting |
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04/07 |
Understanding
Samtec's Electrical Circuit Simulation Models
of Cable Assemblies |
Corey Kimble
Samtec
|
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02/07 |
PCB
Design Methods for Optimum FPGA SerDes Jitter
Performance - DesignCon 2007 |
Steve
Weir
Teraspeed Consulting
|
|
|
02/07 |
A New Innovation: Connectorless Probing Enables High Speed Serial Protocol Testing - DesignCon 2007 |
Barbara P. Aichinger
FuturePlus Systems Corp. |
|
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01/07 |
Design
and Application of an Optical Backplane Connection
System - DesignCon 2007 |
Brian
Vicich, Ken Hopkins,
Richard Pitwon
|
|
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01/07 |
A
Novel Procedure for Characterization of Multi-Port
High Speed Balanced Devices - DesignCon 2007 |
Jim
Nadolny
Vahe' Adamian |
|
|
12/06 |
Link Path Modeling for SI Analysis |
Jim
Nadolny |
|
|
06/06 |
Cable
Assembly Modeling |
Jim
Nadolny |
|
|
02/06 |
IBIS
Connector Models: Facts vs. Fiction - DesignCon 2006 TecPreview
| Jim
Nadolny
Corey Kimble |
|
|
|
11/05 |
Advanced
Edge Card Transitions |
Scott
McMorrow
Teraspeed Consulting |
|
|
09/05 |
Simplified
Design and Modeling of Surface Mount Connector Pad Transitions for Applications
at 10 to 20 Gbps NRZ |
Brian
Vicich, Samtec,
Scott McMorrow, Teraspeed |
s
|
|
08/05 |
How
to Use Connector Spice Models |
Scott
McMorrow |
s
|
|
06/05 |
Understanding
the Apparent Impedance of Interconnects |
Julian
Ferry |
s
|
|
03/05 |
Designing
High Speed Cable Assemblies |
Scott
McMorrow |
s
|
|
02/05 |
RoHS
Compliant |
Jan
Hrouda |
s
|
|
02/05 |
Final
Inch® - A Plug-and-Play Reference Design Solution for High Speed Interconnects |
Julian
Ferry |
|
|
12/04 |
High
Speed Flex Circuit Design Considerations |
Scott
McMorrow |
s
|
|
08/04 |
Connector
Pinout - the Art and Science of Connector Grounds |
Scott
McMorrow |
s
|
|
04/04 |
Designing
High Speed Cable Assemblies
|
Emad
Soubh |
s
|
|
|
04/04 |
Webinar -
Advances
in Design, Modeling, Simulation and Measurement Validation of High Performance
Board-to-Board 5 to 10 Gbps Interconnects |
Brian Vicich, Samtec,
Scott McMorrow, Tom Dagostino, Bob Ross, Teraspeed,
Rob Hinz, Cider Designs |
QTE-DP
QSE-DP
EQCD
HFEM-DP
HFEM-SE |
|
|
02/04 |
DesignCon
- Advances
in Design, Modeling, Simulation and Measurement Validation of High Performance
Board-to-Board 5 to 10 Gbps Interconnects |
Brian Vicich, Samtec,
Scott McMorrow, Tom Dagostino, Bob Ross, Teraspeed,
Rob Hinz, Cider Designs |
|
|
11/03 |
Samtec
Connector Models for Electrical Simulation
|
Corey
Kimble |
s
|
|
09/03 |
Optimizing
Flex Circuitry
|
Glenn
Menear |
s
|
|
07/03 |
Final
Inch®
|
Dave
Givens |
s
|
|