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ONE PIECE
RUGGED AND POWER INTERFACES |
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| Micro Pitch |
| One Piece Interface |
Specifications
- Pitch: 1mm (.0394”)
- Stack Height: 1,65mm (.065”)
- Contacts: 5-30
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Series
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SEI – One Piece Interface
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Features
- Fine pitch
- Low Profile
- Optional screw inserts
- Optional alignment pins
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Additional Links
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| One Piece Elevated Profile System |
Specifications
- Pitch: 1mm (.0394”)
- Stack Height:
o 3mm (.118”)
o 6mm (.236”)
o 10mm (.393”)
- Contacts: 10-100
- Performance: Up to 12.0 GHz/24
Gbps
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Series
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FSI – One Piece Interface
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Features
- Fine pitch
- Screw mount option available
- Flex Data Link mating option available
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Additional Links
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Specifications
- Pitch: .050” (1,27mm)
- Stack Height: 3,00MM (.118")
- Contacts: up to 30 I/Os
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Series
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SIBF – One Piece Interface
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Features
- Low profile
- Choice of alignment pins
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Additional Links
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| One Piece Power Interface |
Specifications
- Pitch: .050” (1,27mm)
- Stack Height: .118" ( 3mm)
- Contacts: 3, 7, or 10
- Current Rating: 6.2A @ 75C Ambient
(5 contacts powered)
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Series
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OPP – One Piece Power Interface
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Features
- Screw insert option for Rugged environments
- Alignment pins on either side of connector
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Additional Links
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| .100” (2,54mm) Pitch |
| One Piece Interface |
Specifications
- Pitch: .100” (2,54mm)
- Stack Height: 3,81mm (.150”)
- Contacts: 2-30
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Series
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SIB – One Piece Interface
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Features
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Additional Links
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Specifications
- Pitch: .100” (2,54mm)
- Stack Height: 6mm (.236”)
- Contacts: Up to 15 I/Os
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Series
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SIR1 –
Right Angle, One Piece Interface
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Features
- Right angle orientation
- Large contact deflection
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Additional Links
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| Pogo Pin One Piece Interface |
Specifications
- Pitch: .100” (2,54mm)
- Stack Height: 4,50mm (.177”)
- Contacts: 2-10
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Series
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PGP – Pogo Pin One Piece Interface
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Features
- Double or single row
- Optional alignment pins
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Additional Links
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| High Density Interface |
| High Density Board Interface |
Specifications
- Pitch: .050” (1,27mm)
- Stack Height:
o 1,65mm (.065”)
o 3mm (.118")
- Contacts: 200, 300, 400, 900
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Series
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GFZ – Solderless High Density Board Interface
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Features
- Ideal for board stacking, module-to-board, and LGA interfaces
- Solderless Interface
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Additional Links
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| Related Links |
| Rugged / Power Information
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If you do not find the product series you are looking for above, please contact
eNewProducts.
To ensure a product meets TS 16949, automotive, or any other specific standards,
the product must be an ACD Series. Go to www.samtec.com/TS
for complete details.
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