|
Power Integrity Guidelines include:
-
 The
total path resistance through attachments and planes must be considered when sizing
connectors for a power system.
- High current carrying power connectors
should be placed as far away from the PCB edges as possible.
- Interweave power and ground pins
to spread current across a larger surface area on the planes.
- Connectors with higher contact
efficiency can be used in high current systems to reduce the size and cost of the
power delivery system.
The number and thickness of power
planes in the PCB had a great effect on the routing of power traces. Efficient splitting
of power over pins can greatly impact overall performance. Heat dissipation from
the connector must also be considered when determining placement on a board in order
to ensure optimum performance.
For questions on Samtec’s Power
Integrity Guidelines, contact our Power Integrity
Group.
|