HIGH SPEED BOARD-TO-BOARD
EDGE CARD / MICRO BACKPLANE
MICRO PITCH BOARD-TO-BOARD
STANDARD BOARD-TO-BOARD
RUGGED / POWER
HIGH SPEED CABLE ASSEMBLIES
RF CABLE AND COMPONENTS
IDC / DISCRETE WIRE
PANEL & I/O
STANDARDS / PLATFORMS
CUSTOM PRODUCTS
PRODUCT INFORMATION
QUALITY / PROCESSING / TOOLS
SIGNAL INTEGRITY SERVICES
RUGGED / POWER INTEGRITY
SUDDEN SERVICE
SERVICE CENTER
TECHNICAL LIBRARY
 
Standard Products

Samtec Introduces
New High Speed
Dual Stack
Edge Card System

 

Samtec has recently introduced a new high speed edge card socket that accepts two PCB cards.  The connector accommodates two .062" (1.6mm) thick PCB cards.  This .8mm (.0315") pitch system, in a right angled configuration, allows "dual stacked" cards at an industry standard 7mm (.276") spacing between cards.

The .8mm (.0315") pitch right angle Edge Rate™ Dual Stack Edge Card Socket (DSEC Series) is available with 30, 40 or 50 Edge Rate™ contacts per row. This rugged contact system is optimized for superior signal integrity and impedance control, high cycles, reduced broadside coupling, and low insertion/withdrawal force.

Lead-free solder charge terminations for easy board processing are standard with tin-lead solder charges available as an alternative option. Additional card spacings and an elevated single-card system are also available.

In addition to this right angle Dual Stack System, Samtec offers Edge Rate™  contact edge card sockets in surface mount and edge mount designs for parallel, perpendicular, and planar board mating. Right angle, edge mount, and vertical stamped contact sockets in .635mm (.025") and 1mm (.0394") pitches are also available.


Back to New Products Menu

Contact Us  |   About Us  |   Jobs  |   Environmental Compliances  |   Help  |   Recent News  |   New Products
           
Copyright © Samtec, Inc