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SamArrayInterconnects Provide High Density Board Stacking


Samtec’s new Sam Array™ interconnects provide high density, high speed, and high reliability with standard board-to-board interconnects.


These 1,27mm (.050") pitch interfaces (YFS, YFT, YFW Series) are available up to 500 I/Os. At 100 pS rise time, the maximum differential impedance mismatch is 3%, and the maximum near end cross talk is .05% - 3.5%. The system performs up to 10 GHz. Complete testing data is available at www.samtec.com/SignalIntegrity/index.aspx.

The YFS socket features Samtec’s reliable four finger Tiger Eye contact. Solder balls are attached to optimize reflow soldering. Standard board-to-board spaces are 5mm, with 7mm, 9mm, 12mm, 19mm & 25mm systems in design.

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