| DATE |
TITLE |
AUTHOR/
PUBLICATION |
FIND OUT
MORE |
| 02/12 |
DesignCon 2012 – Connector Models – Are they any good? |
Samtec, Inc. |
|
| 02/12 |
Design Con 2012 - Comprehensive Analysis of Flexible Circuit Materials Performance in Frequency and Time Domains |
DuPont Electronics & Communications, Samtec, Inc. |
|
| 01/11 |
DesignCon 2011 - Novel Transmission Line for 40 GHz PCB Applications |
Jamal S. Izadian, Ph.D.,
RFCONNEXT, Inc.
Julian Ferry, Samtec, Inc.
Justin McAllister, Samtec, Inc. |
|
|
06/10 |
Optimizing BNC PCB Footprint Designs for Digital Video
Equipment |
Tsun-kit Chin
Applications Engineer,
National Semiconductor Corp. |
BNC7T |
|
08/09
|
Increasing Bandwidth and Connectivity in Small Form
Factor, High-Performance Embedded Applications: The
I/O-Centric, High-Speed SUMIT Interconnect Standard |
VersaLogic Corp |
|
| 06/09 |
EPLSP Series High Speed I/O Cable Assembly, Equalized Cable Assembly, 3 Meter Length, 6.25 Gbps Performance Reference Design |
Samtec/Teraspeed |
|
|
04/09
|
RF Characterization of 2.45 GHz Antenna Assembly with Integrated Feedline
|
Samtec, Inc. |
|
|
04/09
|
HapsTrak II standard
|
Jonas Magnusson, Synplicity, Inc. |
|
03/09
|
Transformation of Samtec Connector Test Data For 85 ohm Differential Impedance Applications
for RU8
|
Samtec, Inc. |
|
|
02/09
|
DesignCon 2009 - Characterizing Non-Standard Impedance Channels with 50 Ohm Instruments
|
Samtec, Inc.
Agilent Technologies, Inc. |
|
|
02/08 |
Power Testing Standards White Paper
|
Samtec, Inc. |
|
|
01/08 |
Samtec Standard Cable Shielding Performance |
Samtec
Jim Nadolny,
Cesar Arroyo |
|
|
10/07 |
Understanding Voltage and Power Ratings |
David Scopelitti
D-Scope-Tech Inc. |
|
|
09/07 |
HFEM-SE High Speed Flex Data Link SPICE Model Validation Report |
Kieran Kelly |
|
|
08/07 |
Linear vs. Non-Linear Contact Analysis |
Brian Vicich, Craig Ryan,
Kevin Meredith,
Samtec |
|
|
08/07 |
Solectron HD Mezz Connector Processing Trial SMT Assembly Report
|
Samtec,
Solectron, Molex, |
|
|
08/07 |
EMI Design of Shielded Cable Assemblies
|
IEEE, Jim Nadolny
Samtec, Inc. |
|
|
08/07 |
Contact Plating Effects on Signal Integrity – QTE-028-07-L-D-DP-A
Mated with QSE-028-01-L-D-DP-A
|
Corey Kimble
Samtec |
|
|
08/07 |
Contact Plating Effects on Signal Integrity – QTE-020-07-L-D-A
Mated With QSE-020-01-L-D-A
|
Corey Kimble
Samtec |
|
|
08/07 |
Contact Plating Effects on Signal Integrity – QTE-028-01-L-D-DP-A Mated With
QSE-028-01-L-D-DP-A
|
Corey Kimble
Samtec |
|
|
08/07 |
Contact Plating Effects on Signal Integrity – QTE-020-01-L-D-A Mated With
QSE-020-01-L-D-A
|
Corey Kimble
Samtec |
|
|
06/07 |
Ribbon Cable Assembly Comparision Summary |
Jim Nadolny & Justin McAllister,
Samtec, Inc. |
|
|
05/07 |
The Development and Verification of Mixed Potential Integral Equation Field Solvers
in Electromagnetics |
J. Rodgers
K. Chuang |
|
|
05/07 |
Lubricant use in Connector Systems Improves Cycles and Wear
|
Brian Vicich,
Samtec, Inc. |
|
|
04/07 |
A Comparison of the Edge Rate vs. Stamped/Cut Contact |
Samtec |
|
|
08/06 |
A Novel Procedure for Characterization of Multiport High-Speed Balanced Devices
|
Vahe' Adamian
Brad Cole
Ultrimetrix |
|
|
06/06 |
Hardware specification for Rocket-IO Serial Link (RSL)
|
Sundance |
|
|
01/06 |
Using the Agilent Physical Layer Test System (PLTS) For Acquiring Time Domain Data
|
Samtec |
|
|
01/06 |
Universal LVDS Ribbon Cable |
Marc Defossez,
Xilinx, Inc. |
|
|
12/05 |
Lead-Contamination in Lead-Free Electronic Assembly
|
AIM, Inc. |
s |
|
12/05 |
TDR for Differential Pair Characterization
|
Abe Riazi,
Interconnect Strategies |
s |
|
12/05 |
TI Connecting ADS8410/13 with Long Cable
|
Bhaskar Goswami,
Rajiv Mantri
Texas Instruments
|
|
|
|
|
|
|
|
11/05 |
|
David Naylor
Xilinx, Inc., Xcell Journal |
|
|
11/05 |
Selecting Connectors for Multi-Gigabit Transceiver Designs
|
Marc Defossez
Xilinx, Inc., Xcell Journal |
QSE/QTE,
YFS/
YFT |
|
10/05 |
RocketIO MGTs with High-Speed Samtec QTE/QSE Connectors and EQCD-EQDP Cable Assemblies
|
XILINX
|
QSE,
QTE,
QTE-DP,
QSE-DP,
EQCD,
EQDP |
|
09/05 |
TDR for Differential Pair Characterization - Part 1
|
Abe Riazi
Interconnect Strategies |
s |
|
08/05 |
Dynamic Range Determination and S-Parameter Accuracy Validation For High Frequency
Time Domain Network Analyzer (TDNA) Measurements
|
Tom Custer |
s |
|
07/05 |
Comparison of Eye Patterns Generated by Synopsys HSPICE and the Agilent PLTS
|
Jim Nadolny |
s |
|
07/05 |
EQCD High Data Rate Cable Assembly Spice Model Validation Report
|
Kieran Kelly |
|
|
01/05 |
Part 1 - Golden Standard Overview
|
Julian Ferry, Dan Piscotty, Samtec
Dr. Richard Elco,
Independent Consultant |
s |
|
01/05 |
Part 2 - Golden Standard Transmission Line Theory
|
Julian
Ferry, Dan Piscotty, Samtec
Dr. Richard Elco, Independent Consultant |
s |
|
01/05 |
High Speed MMCX Competitive Comparison Report
|
Samtec |
s |
|
11/04 |
Supplemental high Speed Characterization Report - Fold Comparison Report - HFEM2-014-T-05-00-DP
|
Samtec |
|
|
06/04 |
Comparison of Vector Network Analyzer and TDA Systems IConnect®
Generated S-Parameters
|
Kieran Kelly |
|
|
06/04 |
HFEM Series -- Copper Shield and Silver-Ink Shield |
Kieran
Kelly, Samtec
Russ Moser,
The Orion Group |
|
|
01/04 |
Flex Characterization
|
Scott McMorrow
Teraspeed |
|
