HIGH SPEED BOARD-TO-BOARD
EDGE CARD / MICRO BACKPLANE
MICRO PITCH BOARD-TO-BOARD
STANDARD BOARD-TO-BOARD
RUGGED / POWER
HIGH SPEED CABLE ASSEMBLIES
RF CABLE AND COMPONENTS
IDC / DISCRETE WIRE
PANEL & I/O
STANDARDS / PLATFORMS
CUSTOM PRODUCTS
PRODUCT INFORMATION
QUALITY / PROCESSING / TOOLS
SIGNAL INTEGRITY SERVICES
RUGGED / POWER INTEGRITY
SUDDEN SERVICE
SERVICE CENTER
TECHNICAL LIBRARY
 
High Speed Board-to-Board
RUGGED HIGH SPEED STRIPS
Edge Rate™
Specifications
  • Pitch: .8mm (.0315”)
  • Stack Height: 7-16mm
  • Contacts:  Up to 150 I/Os
  • Performance: Up to 10.5 GHz / 21 Gbps Series
Series
 
Features
  • Rugged Edge Rate™ contacts
  • Contact designed for high speed applications
  • Smooth, milled, mating surface
  • High cycle life
  • Optional latching
  • Reduces broadside coupling
  • “Zippered” mating/unmating
  • Vertical, perpendicular, and horizontal applications

 

Additional Links

 

Q Rate® Slim, Rugged, High Speed Interconnects 
Specifications
  • Pitch: .8mm (.0315”)
  • Stack Height: 7mm and 10mm
  • Contacts:  Up to 156 I/Os
  • Performance: Testing in progress Series
Series
Features
  • Rugged Edge Rate™ contacts
  • Integral ground/power plane
  • Slim Footprint (less than 5mm wide)
  • Optimized signal integrity
  • High cycle life
  • “Zippered” mating/unmating
  • 1,39mm contact wipe insertion depth
Additional Links

 

Q2™ Rugged/High Speed Interconnects
Specifications
  • Pitch: .635mm (.025”)
  • Stack Height: 10-16mm
  • Contacts:  Up to 208 I/Os
  • Performance: Up to 8.0 GHz / 16 Gbps
Series
  • QFS –.635mm Socket
  • QMS - .635mm Terminal
  • QFS-DP – .635mm Differential Pair Socket
  • QMS-DP – .635mm Differential Pair Terminal
  • QFSS – .635mm Shielded Socket
  • QMSS – .635mm Shielded Terminal


Features
  • Optional EMI shielding
  • Increased insertion depth
  • Dual stage hot pluggable
  • Integral ground/power plane
  • Retention pins available
  • Power and RF end options
  • 15,24mm stacking version meets PCIE specifications
  • Vertical, perpendicular, and horizontal applications
Additional Links

 

Razor Beam™Slim, Fine Pitch, Interconnects
Hermaphroditic Interconnects
Specifications
  • Pitch:
    o  .635mm (.025”)
    o  .5mm (.0197”)
  • Stack Height: 6-12mm
  • Contacts:  Up to 100 I/Os
  • Performance: Up to 10.0 GHz / 20 Gbps
Series
  • LSS – .635mm Hermaphroditic Connector
  • LSHM – .5mm Hermaphroditic Connector

Features
  • Fine pitch
  • Slim footprint
  • Rugged
  • Undercut retention notches
  • Audible click when connectors are fully mated
Additional Links

 


If you do not find the product series you are looking for above, please contact eNewProducts.

To ensure a product meets TS 16949, automotive, or any other specific standards, the product must be an ACD Series. Go to www.samtec.com/TS for complete details.
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