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HIGH SPEED BOARD-TO-BOARD
EDGE CARD / MICRO BACKPLANE
MICRO PITCH BOARD-TO-BOARD
STANDARD BOARD-TO-BOARD
RUGGED / POWER
HIGH SPEED CABLE ASSEMBLIES
RF CABLE AND COMPONENTS
IDC / DISCRETE WIRE
PANEL & I/O
STANDARDS / PLATFORMS
CUSTOM PRODUCTS
PRODUCT INFORMATION
QUALITY / PROCESSING / TOOLS
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RUGGED / POWER INTEGRITY
SUDDEN SERVICE
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Edge Card / Micro Backplane
MICRO BACKPLANE SYSTEMS
SEARAY™ High Speed, High Density Arrays
Specifications
  • Pitch: .050” (1,27mm)
  • Contacts: Up to 300 I/Os
  • Performance: Up to 9.5 GHz / 19 Gbps
Series
  • SEAM – .050” (1,27mm) Terminal
  • SEAF - .050” (1,27mm) Socket
  • SEAF-RA – .050” (1,27mm) Right Angle Socket  


 
Features
  • Maximum routing and grounding flexibility
  • Lower insertion/extraction forces vs typical array products
  • 4 row and 6 row options
  • “Zippered” mating/unmating
  • Unique solder charge technology
Additional Links

 

High Speed Edge Card
Specifications
  • Pitch: .8mm (.0315”)
  • Contacts: Up to 200 I/Os
  • Performance: Up to 10.5 GHz / 21 Gbps
  • Card Slot: 1,60mm (.063”)
Series
  • HSEC8-DV – .8mm High Speed Edge Card
  • HSEC8-EM – .8mm High Speed Edge Card (Edge Mount)

 
Features
  • Optional board locks
  • Single ended and differential pair signaling
Additional Links
Edge Rate™ Rugged, High Speed Interconnects
Specifications
  • Pitch: .8mm (.0315”)
  • Contacts: Up to 100 I/Os
  • Performance: Up to 10.5 GHz / 21 Gbps
Series
 
Features
  • Rugged Edge Rate™ contacts
  • Contact designed for high speed applications
  • Smooth, milled, mating surface
  • High cycle life
  • Reduces broadside coupling
  • “Zippered” mating/unmating
Additional Links
Specifications
  • Pitch: .5mm (.0197”)
  • Stack Height:
  • Contacts:
  • Performance:
Series
  • ERF5 – .5mm Socket
  • ERM5 – .5mm Terminal

erm5
Features
  • Surface mount
  • Available on 10, 20, 30, 40 and 50 Positions Per Row
  • Double Row
  • Selective Gold Plating
Additional Links
Q2® Rugged/High Speed Interconnects
Specifications
  • Pitch: .635mm (.025”)
  • Contacts: Up to 208 I/Os
  • Performance: Up to 8.0 GHz / 16 Gbps
Series
  • QFS –.635mm Socket
  • QMS - .635mm Terminal
  • QFSS - .635mm Shielded Socket
  • QMSS - .635mm Shielded Terminal
  • QFS-RA – .635mm Right Angle Socket
  • QMS-RA – .635mm Right Angle Terminal
  • QFS-EM – .635mm Edge Mount Socket
  • QMS-EM – .635mm Edge Mount Terminal
  • QFSS-EM - .635mm Shielded Edge Mount Socket
  • QMSS-EM - .635mm Shielded Edge Mount Terminal


Features
  • Increased insertion depth
  • Dual stage hot pluggable
  • Integral ground/power plane
  • Shielded option available
  • Edge mount option available
  • Power and RF ends options
  • Differential Pair Available
Additional Links
Q Strip® High Speed Interconnects 
Specifications
  • Pitch: .635mm (.025”)
  • Contacts: Up to 200 I/Os
  • Performance: Up to 9.0 GHz / 18 Gbps
Series
  • QTS - .635mm Terminal
  • QSS – .635mm Socket
  • QTS-RA – .635mm Right Angle Terminal
  • QSS-RA - .635mm RIght Angle Socket


Features
  • Integral ground/power plane
  • Connector to connector retention options
  • Vertical, perpendicular, and horizontal applications
Micro TCA Connectors
Specifications
  • Pitch: .75mm (.030”)
  • Contacts: Up to 170 I/Os
  • Card Slot: 1,60mm (.063”)
Series
  • MTCA – Micro TCA Connector

 
Features
  • Compliant to μTCA™ standard architecture
  • Form/fit/function compatibility with Molex Press fit tails
  • Supports hot plugging and high speed serial connections
Additional Links
Dual Stack Edge Card (In Design)
Specifications
  • Pitch: .8mm (.0315”)
  • Contacts: Up to 100 per card slot
  • Performance: Testing in progress
  • Card Slot: 1,60mm (.063”)
Series
  • DSEC – Right Angle Dual Stack Edge Card Socket

 
Features
  • Dual stacked card slots
  • Right angle orientation
  • Edge Rate™ contacts
Additional Links
Bi-Level Edge Card (In Design)
Specifications
  • Pitch: .5mm (2 levels 0f 1mm staggered)
  •  Contacts: Up to 140 I/Os
  • Performance: Testing in progress
  • Card Slot: 1,60mm (.062”) & 2,36mm (.093”)
Series
  • BEC5 – .8mm High Speed Edge Card (Edge Mount)

 bec5
Features
  • 2 mating stages (bi-level mating)
  • 4 rows of contacts
  • High speed Edge Rate™ contacts
  • Saves PCB real estate
Additional Links
Related Links
Signal Integrity Support Industry Standards and Specifications

If you do not find the product series you are looking for above, please contact eNewProducts.

To ensure a product meets TS 16949, automotive, or any other specific standards, the product must be an ACD Series. Go to www.samtec.com/TS for complete details.
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