| Brand Name |
Application |
| AcceleRate™ |
High Speed Cost Effective Coax Cable Assembly System |
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| AccliMate™ |
Sealed Circular & Rectangular Plugs and Receptacles for IP67/IP68 applications where a rugged, water tight connector is needed. |
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| Align & Latch |
Rugged connectors designed to lock together and are ideal for high vibration and shock applications. |
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| Blade-n-Beam |
Micro Pitch Contact System designed to be mating/alignment friendly and cost effective. |
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| BullsEye™ |
Low cost, SMA replacement test probe system. |
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| Data Rate (High Speed Cable) |
High Speed Cable Assembly systems provide flexible solutions to meet strigent signal intergrity specifications on a variety of centerlines and configurations. |
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| DataBank™ |
High speed cable assembly utilizing 30 AWG, 100 ohm twinax cable, optimizes signal integrity with no transition board between the cable and contacts. |
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| DP Array™ |
Differential Pair Array maximizes bandwidth per square inch of board area ideal for High Density and High Speed applications |
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| Edge Rate |
Designed for High Speed applications, this robust contact improves "Zippered" unmating |
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| Flex Circuits |
High Speed Flex Data Links for Signal Integrity Applications from 60mm to 200mm |
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| FleXYZ™ |
Interfaces that provide design flexibility in all three planes (X,Y,and Z axis) by specifying the number of rows, the number of pins per row, and the desired board spacing all with standard interconnects. |
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| FOURRAY™ |
Four row terminal and socket strips ideal for High Density applications |
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| HD MEZZ |
Elevated High Density Array with a open pin field for Single-Ended or Differential Pair configurations ideal for High Density and High Speed applications |
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| I/O Interfaces |
D-subs, modular jacks, miniature DINs, and high speed serial interfaces for all your I/O applications. |
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| ISORATE |
Lower cost alternative to machined RF connectors; ideal to isolate signals. About half the cost and 85% of the performance of machined RF. |
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| LPARRAY™ |
Low Profile Open Pin Field Array with lower insertion/extraction forces ideal for high density and high speed applications |
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| Micro Card |
Unique low profile, high speed card-to-board interface for serial ATA™ and other high speed daughtercard applications. |
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| Mini Mate® |
Interconnects designed for power applications that require up to 4 Amps of current capacity. |
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| Mixed Technology |
Interconnect system with both through-hole and surface mount leads that provides additional strength for high cycle, high vibration applications. |
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| Power Buy™ |
Contact System designed for power applications up to 7 Amps of current carrying capacity. |
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| Power Eye™ |
Contact System designed for power applications up to 15 Amps of current carrying capacity. |
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| Power Mate™ |
Interconnects designed for power applications that require up to 13 Amps of current capacity. |
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| Power Strip |
Power interconnect system rated up to 30A per contact. Vertical, right angle, and combination power/signal pin configurations available. |
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| Press Fit |
2mm Press Fit headers and sockets ideal for High Density applications. |
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| Q Pairs® |
High Speed Differential Pair terminals, sockets, and cable assemblies that allow customers to route signals out-of-phase for improved electrical performance. |
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| Q RATE™ |
The next generation Q Strip interconnect - footprint compatible with Samtec's popular Q Strip (QTE, QSE Series), but utilizes the rugged Edge Rate contact. |
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| Q Strip® |
High Speed terminals, sockets, and cable assemblies with controlled impedance that can be routed either single-ended or differentially for enhanced signal integrity. |
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| Q2™ |
Shielded connector system provides EMI suppression ideal for High Speed applications. |
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| Razor Beam™ |
Micro Pitch, Rugged, High Speed connectors. |
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| RiseUp® |
High Speed board with embedded ground plane mates with micro edge card connectors for greatly improved performance over traditional connector sets for elevated board stacking. |
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| Rugged™ |
High reliability, high cycle, and high retention contacts, shrouded and keyed insulators with positive retention features, and PCB terminations including press fit, solder locks and mechanical hold-down options that are ideal for high reliability applications. |
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| SamArray® |
Mating system that provides high density, high speed, and high reliability with standard board-to-board interconnects. |
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| SEARAY™ |
Open Pin Field Array with lower insertion/extraction forces ideal for high density and high speed applications. |
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| Storage Combo |
These combination signal and power connectors eliminate the need for the flat ribbon cables and power wire harnesses that are commonly used when connecting hard drives. |
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| Tiger Beam™ |
Post and Beam Contact System with reliable performance and consisdered the best cost of all Samtec contacts. |
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| Tiger Buy |
Tuning Fork Contact System with high mating and unmating retention and cost effective. |
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| Tiger Claw™ |
Dual Wipe Contact System ideal for pass-through applications and ultra low profile. |
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| Tiger Eye Discrete™ |
Multi-Finger Discrete Wire Contact System ideal for high reliability and high mating cycle applications |
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| Tiger Eye Lite™ |
Multi-Finger Contact ideal high reliability applications. |
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| Tiger Eye System™ |
Multi-Finger Contact System ideal for high reliability and high mating cycle applications. |
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| Tiger Eye™ |
Multi-Finger Contact ideal for high reliability and high mating cycle applications. |
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| Tiger-Eye-IDC |
Multi-Finger IDC Cable Contact System ideal for high reliability and high mating cycle applications. |
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| TRUE 75™ |
Connectors certified 75 ohm +/- 3 ohm for straight and +/- 4 ohm for right angle ideal for 3 Gbps |
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| Z Beam® |
Solderless Contact System ideal for high density and low profile applications. |
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