Samtec "Final
Inch®" is the design of the break out region (BOR) on a printed
circuit board (PCB). In this region, signals coming from the connector
pins are connected to traces on the PCB. Generally, from the BOR, the
traces can be designed as standard transmission line structures for signal
distribution across the PCB.
- QTE/QSE - Q Series™ (.8mm)
- QTH/QSH - Q Series™ (.5mm)
- DPAM/DPAF - DP Array™ (2,16mm)
- YFS/YFT/YFW - (.050")
- QMS/QFS - Q2™ (.635mm)
- QTS-RA/QSS - Q Series™ (.635mm)
- SEAM/SEAF - SEARAY™ (.050")
Click here to go directly to the Final Inch® Information Request Form.
Final Inch®
Overview
Typical PCB transmission
line structures have been studied in depth over the years, and their application
is common knowledge in the signal integrity arena.
Typically, connectors require solder thru holes or surface mount pads for attachment to the board. Also, most signal traces are routed on internal board layers. Thus, vias are often required in the break out region in order to establish connection between the connector pins and the signal traces. These vias can add significantly to the routing headaches.
One of our over-riding goals at Samtec is to try to achieve the highest level of “ease of use” of our connectors. We want to make our connectors the absolute, easiest connectors to design in to a system. As part of this effort, we wanted to take the PCB recommended BOR design concept to a higher level.
Click here to see
a typical PCB design flow.
Click here to see PCB design flow when using Samtec's
Final Inch® BOR.
Samtec has designed and developed Final Inch® - a BOR design that is optimized for ease of PCB manufacture AND for high speed performance. And we are going several steps further.
First, we are offering this design as a downloadable file in Gerber and .dxf formats, for cut and paste application into standard board layout software packages. The entire design will be treated as a component that you can drop into your software and route to and from.
Electrical
Models
Second, we are providing SPICE models of this board section and the associated
connector/s. These will be downloadable as well in HSPICE and can be cut
and pasted into the standard SI simulation packages. PSpice is available
for the connector and BOR only. You therefore can simulate the electrical
performance of this entire, critical region and study its impact in your
proposed system.
Third, we have test and evaluation boards based on these designs. These boards contain the actual BOR design and attached lengths of controlled impedance and matched length transmission lines. These lines will terminate into industry standard coaxial connectors, which will provide easy connection to lab instruments. We are also providing probe points on the boards so that industry standard micro probes can be used since some customers prefer to use probes over SMA’s. You can use these boards to evaluate the connectors’ performance in your own laboratory using whatever signaling schemes you prefer.
Empirical
Signal Integrity Data
Finally, Final Inch® is not complete without validation of the electrical
system performance through signal integrity modeling, simulations and
measurements. Samtec will supply simulation and test reports to support
our Final Inch® Designs.
Samtec is now offering "on request" test data including eye patterns for our Final Inch® circuits using our new Agilent PLTS 50 GHz Characterization System. For more information on this new service, click here.
Click here to view Samtec's Comparison of Eye Patterns Generated by Synopsis HSPICE and the Agilent PLTS white paper. This document shows that there is good correlation between Samtec's Final Inch® HSPICE simulated eye patterns to eye patterns processed from S-parameter data measured with Samtec's new Agilent PLTS 50 GHz High Speed Characterization System. Samtec QPairs® QTE-DP/QSE-DP Final Inch® simulations were used as the test article.
Additionally, we can provide assistance through our Signal Integrity Services Group to customers who wish to utilized the design in some way other than our standard configurations.
Final Inch® physical art and electrical models are available for all of the series below:
- QTE/QSE - Q Series™ (.8mm)
- QTH/QSH - Q Series™ (.5mm)
- DPAM/DPAF - DP Array™ (2,16mm)
- YFS/YFT/YFW - (.050")
- QMS/QFS - Q2™ (.635mm)
- QTS-RA/QSS - Q Series™ (.635mm)
- SEAM/SEAF - SEARAY™ (.050")
- MMCX - RF Connectors
- RU8 - Rise Up® (.8mm)
- PCIE - PCI Express Connectors
- HDAM/HDAF - HD Mezz (1,2mm)
- HSEC8 (.8mm) Edge Card Connectors
- GCAM/GCCA - Databank™
- ERM8/ERF8 - (.8mm) Edge Rate
- MODS-LJ (LifeJack™)
Please note that a license agreement will be required to receive each form of Final Inch® Information you request. Click here to view a read-only copy of the terms and conditions of each applicable license agreement.
For questions on Final Inch®, contact our Final Inch® Group. Click here to review the July 17th article in EE Times featuring Samtec Final Inch®.
* HD Mezz is a trademark
of Molex Incorporated.
