Samtec recently changed our high speed connector test procedures. The new process gives a better representation of the connectors' true performance and eliminates variables that are not connector related.
Our new process uses on-board calibration standards which allow us to de-embed (remove) the effect of printed circuit board (PCB) trace loss. The connectors are soldered to PCBs using standard recommended pad footprints. Short, controlled impedance traces are routed from the pads to electrically optimized SMA connector test points. The calibration process removes the effect of the SMA connector, launch, and trace loss. Thus, the resulting test data includes only the effects of the high speed connector and PCB mounting pads.
By de-embedding the trace loss a significant variable is removed from the test data, so correlating measured and simulated results is much more practical. This results in a higher level of confidence in both the measured data and simulation based models.
Because the loss effects of the PCB trace are removed, the new procedure will often result in a higher 3 dB Speed Rating than earlier test methods.
Click here for more information on Samtec's Speed Rating based on the 3 dB insertion loss point of the connector system.
We currently characterize our new high speed connectors with the new process. We are also retesting many of our older products which were previously characterized with different procedures. During a transition period, characterization reports using different test methods will be available on our website. Please read the reports carefully to note these differences, and be aware that comparing data between old and new reports might not lead to valid "apple to apple" comparisons.
If you would like assistance in interpreting Samtec's test data, please contact our Signal Integrity Group
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