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Standard Products
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High Density .5mm Pitch
Samtec Edge Card Socket
Saves PCB Real Estate
Samtec has expanded its line of high speed
edge card solutions to include a new high density socket
featuring a bi-level mating design, two levels of contacts
on a staggered 1mm (.0394”) centerline, which creates a
card effective 0,5mm (.0197”) pitch. The resulting system
is not only high density, but also saves PCB real estate. |
The Edge Rate™ High Density Edge Card Socket (BEC5
Series) is available with up to 140 I/Os in a 1,00mm
(.0394”) x 1,27mm (.050”) grid PCB pad layout (four rows
of contacts). This system is ideal for high speed
applications benefiting from its rugged Edge Rate™
contacts which are designed for superior impedance
control, and reduced broadside coupling with increased
durability and cycle life.
The 0,5mm (.0197”) pitch high density socket accepts
standard 1,60mm (.062”) and 2,40mm (.094”) thick cards.
Additional features include weld tabs, alignment pins, and
lead-free solder charge terminations for easy board
processing. Tin-lead solder charges, as well as
alternative platings and pin counts, are also available.
In addition to the new BEC5 Series 0,5mm (.0197”) pitch
High Density system, Samtec’s full line of High Speed Edge
Rate™ Edge Card Sockets includes 0,8mm (.0315”) (HSEC8
Series) pitch in surface mount and edge mount designs for
parallel, perpendicular, and planar board mating as well
as a right angle dual stacking design (DSEC
Series).
Stamped contact design sockets are also available in
0,635mm (.025”)
(MEC6
Series), 1mm (.0394”) (MEC1
Series), 1,27mm (.050”) (MECF
Series) and
2mm (.087”) (MEC2
Series) pitches for edge mount, right angle, and vertical
applications. |
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For more information,
contact us at
customerservice@samtec.com. |
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