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Samtec Introduces New High
Speed Edge Rate™ Interfaces
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08/09 |
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Samtec has
expanded its high speed interconnect and cable line featuring its rugged
Edge Rate™ contact system to include a new .8mm (.0315”) pitch...
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Samtec Expands Rugged Edge Rate™ Interface Family |
06/09 |
Samtec has expanded its Edge Rate™ product line with the addition of .8mm (.0315”) pitch Right Angle and Edge Mount connector strips for perpendicular and co-planar applications. |
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Samtec Introduces Mini USB IP68-Rated Sealed Circular System |
05/09 |
Samtec has recently expanded its line of IP68-rated AccliMate™ Sealed Circular Cable Plugs and Receptacles with the addition of a Mini USB B-Type Sealed Circular System. |
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Samtec Introduces 75Ohm BNC System Optimized for 3G SDI |
05/09 |
The emergence of the 3 Gbps 3G Serial Digital Interface (3G SDI) which enables uncompressed digital transfer of 1080p and digital cinema has once again brought interconnect Signal Integrity considerations to the forefront of high speed system design. |
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Samtec Announces High Speed Direct Termination Cable Assembly |
05/09 |
Samtec has expanded its cable line with a new High Speed Cable Assembly featuring its rugged Q2™ connector system and a patent-pending cable termination designed to maximize Signal Integrity. |
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Space-Saving High Speed Interconnect System from Samtec |
04/09 |
Samtec has recently expanded its high speed, micro rugged interconnect offering with the addition of a self-mating, high speed connector system that maximizes PCB real estate with its super-slim body design. |
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Samtec Introduces Razor Beam™ Space-Saving Interconnect Systems |
03/09 |
Samtec’s high speed Razor Beam™ interconnect systems are designed to maximize PCB real estate with their slim, ultra-fine pitch, low profile designs. |
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Mating Orientation Flexibility with Samtec’s New Hinged PowerStrip™ |
03/09 |
Samtec has expanded its rugged PowerStrip™ High Power Interconnect family with a hinged version of its 25 Amp PowerStrip™/25 system. The FMPS/FMPT Series are ideal for applications that call for blind mating or where PCB real estate is tight. |
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Samtec Introduces Space-Saving Super Fine Pitch Interconnects |
01/09 |
Samtec has recently introduced a new narrow body, super fine pitch, low profile board-level interconnect system ideal for applications where board real estate is at a premium. |
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| Disclaimer:
The information in the New Products area may change without notice. All
information posted here are "As Is" at time of release. Samtec,
Inc. does not warrant that errors or changes will be corrected. |