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Samtec has introduced
a new high density power-to-board interconnect system on 2mm (.0787")
pitch (TPCM/TPCF
Series) that can be used for elevated board stacking. These four-row interconnects
can carry 27 amps at 80oC over four banks of four power pins each. An
eight-bank system is currently being tested for power rating. Power banks
are separated from the nearest signal pins by 3.5mm to maximize the power
capacity.
For board stacking
applications, the board spacing with standard connectors can range from
10mm (.394") to 20mm (.787"). End shrouds assure proper mating
in blind applications, and Tiger Buy tuning fork style Phosphor Bronze
contacts provide high retention and cost effectiveness.
Samtec has a broad
line of Power Interfaces for board-to-board and discrete wire-to-board
applications. Discrete wire connectors are available on 4,19mm (.165")
pitch (IPBD
Series) and 2,54mm (.100") pitch (IPL1 Series) and headers and sockets
(IPBT/IPBS
and IPT1/IPS1
Series) are available for vertical board stacking and perpendicular applications.
Click
here to view the specifications for our Power Interfaces.
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