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FLEX
PROCESSING
GUIDE

CONTENTS

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100% SURFACE MOUNT PROCESSING

Optimum Lead Coplanarity
High Temperature Plastics
Sudden Specs on the Net
SMT Lead Strength Testing
Interconnect Processing Group
Suggested Processing Guidelines

SMT COMPATIBLE THROUGH-HOLE

Robust, Low Cost Interfaces
Paste Over Hole
Paste Around Hole

SELF-NESTING SOCKETS

Self-Nesting Sockets

IMPROVED MANUFACTURABILITY

Locking Clips
Alignment Pins
Pick-and-Place Pads
Tape & Rell Packaging

LOWER TOTAL COST

No Pad
Molded Pad
IR Compatible Through-Hole
Value Engineering

100% SURFACE MOUNT BOARD PROCESSING

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Optimum Lead Coplanarity

• Stamped leads can offer significantly better coplanarity specifications than formed leads
• Leads are stamped in one operation from flat stock without secondary forming operations
• Available on selected sockets and terminals where high lead counts and/or fine pitch cause special coplanarity concerns

High Temperature Plastics

• All Samtec micro and surface mount interconnects have Liquid Crystal Polymer insulators or other high temperature plastic
• Allows higher processing temperatures (up to 230° C) often required in infra-red board processing
• Many through-hole interconnects are available with high temperature plastics for mixed technology boards

Sudden Specs on the Net

• Detailed materials and processing specifications available on the
  World Wide Web
• Summaries of test results on our most popular interconnects
• Available at www.samtec.com or request CD ROM version

SMT Lead Strength Testing

• Test results verify that the pull force of Samtec connectors off the board is higher than the withdrawal force of mated connectors
• For Samtec connectors the force required to pull the connector off the board is typically three to six times the force required to separate a mated connector pair

TEST RESULTS
Pitch	Terminal Socket	Pull Force Average	Pull Force Minimum	Shear Force Average	Shear Force Minimum	CALCULATED  Unmating Force Average
(2,00mm) .0787"	TMM-125 CLT-125	(498) 112 (53) 12	(347) 78 (49) 11	(1126) 253 (263) 59	(1050) 236 (147) 33	(9) 2
(1,27mm) .050"	FTS-125 CLT-125	(267) 60 (80) 18	(111) 25 (49) 11	(1064) 239 (218) 49	(730) 164 (129) 29	(27) 6
(1,27mm) .050"	TFM-125 SFM-125	(249) 56 (218) 49	(205) 46 (182) 41	n/a n/a	n/a n/a	(58) 13 (22)5 (LIF)
(1,00mm) .0394"	FTM-125 CLM-125	(125) 28 (71) 16	(71) 16 (53) 12	(708) 159 (182) 41	(610) 137 (129) 29	(9) 2
(1,00mm) .0394"	BKT-125 BKS-125	(107) 24 (38) 8	(49) 11 (27) 6	(449) 101 (352) 79	(392) 88 (276) 62	(9) 2
Data given in (Newtons) Pounds

Interconnect Processing Group

• Free micro/SMT board processing consulting service from Samtec
• Help lower total applied cost of boards
• Help improve overall processing and manufacturability of boards
• Help resolve complex interconnect processing issues or concerns

Suggested Processing Guidelines

• Catalog pages clearly show processing specifications for surface mount interconnects
• Maximum processing temperatures and lead coplanarity specifications are included
• Suggested PCB layouts including alignment pin locations are shown

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SMT COMPATIBLE THROUGH-HOLE

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Robust, Low Cost Interfaces

• Through-hole interconnects provide robust interfaces on surface mount boards
• Secondary reflow operations are not necessary with high temperature IR
  compatible interconnects

  Three common methods of processing are in use:

2 Paste Over Hole

• Solder can be screened over and into the plated through-hole and then the tail inserted into it
• This process is ideal for thin, flat leads that can be inserted through the solder paste without displacing it from the hole

3 Paste Around Hole

• Screening "paste around holes" on a somewhat larger annular ring and
  allowing the capillary action of the molten solder to the lead is useful for larger
  leads with more surface area near to hole
• It is important to deposit enough solder to bridge the gap across the hole from
  the ring to the lead

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SELF-NESTING SOCKETS AND PROCESSING

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Self-Nesting Sockets

• Square tails of Tiger Buy Sockets mate with Tiger Buy Sockets or next PCB
  (Socket plugs into Socket)
• Available on (2,54mm) .100" and (2,00mm) .787" pitch
• Choice of single row, double row and ultra high density multi-row designs

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IMPROVED MANUFACTURABILITY

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Locking Clips

• Locking clips hold the connector in place prior to soldering
• Assure proper seating during reflow
• Simultaneously solder components to both sides of the board

Alignment Pins

• Proper alignment of the connector leads to the pads is critical
• Large lead counts and small pitch make alignment difficult
• Help ensure proper registration
• Decrease the chances of misalignment during mating
• Required in bottom entry applications and 3-board stacking applications

Pick-and-Place Pads

• Optional pick-and-place pads attach to metal terminals or plastic body
• PCB utilization is maximized by discarding pad once processing is complete
• Landing areas are incorporated into many designs and can be designed
  into Application Specific Interconnects

Tape & Reel Packaging

• Protects leads and eliminates incorrect polarization
• High processing speeds and less set up time
• Available as standard option on most common SMT interconnects
• No tooling charges with 125 piece minimum order
• In-house design and manufacture for quick turn-around

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LOWER TOTAL COST

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No Pad

• Sockets may be handled by auto pick-up equipment without any pick-and-place pads, custom nozzles or special machine programming
• On some equipment this can be achieved by programming out the vacuum loss sensor
• Depending on connector configurations and nozzle size, moderate vacuum loss still allows pick-up and placement of the connector without a pick-up pad

Products currently tested without pick-and-place pads include:
Socket	Pitch	Conditions	Results
	(2,54mm) .100"	O-ring	Passed
CLT