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Below
is a list of current Samtec
Technical Documents. Click on the title
to be directed to that specific White Paper or click on the download button to save a zipped PDF file to your hard drive. For more information click one of these sources: Articles, Presentations, Press Releases or White Papers.
For additional
Signal Integrity resources and training, click here.
Click here to view our Application Notes.
DATE |
TITLE |
AUTHOR/
PUBLICATION |
FIND
OUT
MORE |
DOWNLOAD
ZIP FILE |
| _TECHNICAL
DOCUMENTS
TOP |
02/08 |
Molex SEARAY DesignCon White Paper |
Molex Incorporated
Samtec, Inc. |
|
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10/07 |
HD
Mezz™ Intermateability Specifications |
Molex Incorporated
Samtec, Inc. |
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08/07 |
Solectron
HD Mezz Connector Processing Trial SMT Assembly Report |
Solectron, Molex, Samtec |
|
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06/06 |
Solectron
SEARAY™ (SEAF/SEAM Series) Open Pin Filed Array Connector Processing
Trial SMT Assembly Report |
Solectron
Samtec |
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06/06 |
Hardware
specification for Rocket-IO Serial Link (RSL) |
Sundance |
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12/05 |
TI
Connecting ADS8410/13 with Long Cable |
Bhaskar Goswami,
Rajiv Mantri
Texas Instruments
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11/05 |
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David Naylor
Xilinx, Inc., Xcell Journal |
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11/05 |
Selecting
Connectors for Multi-Gigabit Transceiver Designs |
Marc Defossez
Xilinx, Inc., Xcell Journal |
QSE,
QTE
YFS
YFT |
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10/05 |
RocketIO
MGTs with High-Speed Samtec QTE/QSE Connectors and EQCD-EQDP Cable
Assemblies |
XILINX
|
QSE,
QTE,
QTE-DP,
QSE-DP,
EQCD, EQDP |
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